IC-SYSLM
Operations BOM and Process Management
Comprehensive Product Data Management (PDM) solution for semiconductor operations Bill of Materials (BOM) and process network management tailored to the unique needs of semiconductor manufacturing.
Challenges
Complexity and Detail
Semiconductor BOMs include intricate details spanning multiple levels of hierarchy, such as raw materials, components, subassemblies, and final products.
Integration with Multiple Systems
BOM data must be integrated with various systems such as requirements management system, enterprise resource planning (ERP), manufacturing execution systems (MES), and supply chain management (SCM) systems.
Traceability, Qualification & Compliance
Ensuring traceability of materials and components from suppliers to the finished product is essential for quality control and regulatory compliance.
Supplier Management
Coordinating with numerous suppliers, each providing different components, requires accurate tracking of supplier information, lead times, and component specifications within the BOM.
Version Control
Maintaining version control for BOMs, especially when dealing with multiple product variants and design iterations, is challenging.
Customization & Variability
Handling customized orders and managing the variability in components and materials for different customers requires a flexible and dynamic BOM management system.
Lifecycle Management
Managing the entire lifecycle of components, from procurement to end-of-life, requires careful planning and coordination.
Our Solution
BOM Management
Capability to handle complex, hierarchical BOMs including raw wafers, mask sets, and various intermediate up to the final products. Define and manage mask sets, their applications to wafers, and the associated processes.
Process Flow Management
Ability to define detailed manufacturing processes and process network, including sort, bump, binning, die singulation, packaging, and testing. As a wafer goes through the processes, it is essential that the material flows through the approved sourcing networks.
Data Integration and Traceability
Seamlessly integrate with design tools, manufacturing execution systems (MES), and other enterprise systems like requirements management system, ERP. Manage and document changes in BOM and processes, with impact analysis and approval workflows.
Enhanced Collaboration
Enable cross-functional teams to collaborate on BOM and process management in real-time. Facilitate collaboration with suppliers and subcontractors, sharing relevant BOM and process information.
Advanced Security
Role-Based Access Control and Ad-hoc access control. Ensure secure access to sensitive data with role-based permissions and audit trails.
Compliance and Quality Management
Qualify package materials at an assembly location meticulously ensuring semiconductor devices meet the high standards required for reliability, performance, and longevity. Integrate quality control processes, including defect tracking and corrective actions. Maintain comprehensive documentation for processes, materials, and compliance requirements.
Benefits
Centralized Data Repository, Better Collaboration
All BOM-related data is stored in a single, centralized location, ensuring easy access and consistency across departments. Facilitates collaboration among cross-functional teams, improving communication and reducing errors.
Improved Traceability
Enhanced traceability of materials and processes throughout the manufacturing lifecycle, from raw wafers to finished products.
Increased Efficiency
Streamlined workflows and automated processes reduce manual efforts, saving time and improving productivity.
Regulatory Compliance
Helps ensure compliance with industry standards and regulations by maintaining detailed records and audit trails.
Effective Change Management
Simplifies change management processes by providing tools to track and implement changes efficiently and effectively.
Data Integration
Integrates seamlessly with other enterprise systems (ERP, MES), ensuring data consistency and real-time updates across platforms.