Fragmented IP catalog
Internal and third-party IP scattered across repos, spreadsheets and vendor portals — no single source of truth.
One thread. From intent to silicon.The operating system for semiconductor programs.
From IP To GDSII To Finished Silicon— On One Platform
Glide Semi unifies semiconductor IP Management and Operations BoM Management in a single, integrated platform. Design outputs flow straight into wafer, packaging, assembly and test — with your engineers never leaving the tools they already use. No throw over the wall.
Engineers stay in their tools — zero extra work- IP + Operations BoM, one platform
- GDSII → Wafer → Package → Tested Chip
Program · design-to-silicon thread
Live traceabilityGDSII / tapeout
Controller IPinternal wrapper
Substratesourcing
DesignRTL → GDSII
Waferfoundry
Packageassembly · test
Qualified chipship-readydesignoperationsshippable
1
Platform for IP Operations BoM
0
Extra tools for your engineers
Design
Silicon
SiliconEnd-to-End traceability
No
throw-over-the-wall handoffs
Zero Added Workload
Your Engineers Stay In Their Tools. Glide Does The Assembling
Adoption dies when a platform asks engineers to enter data twice. Glide Semi never does. Designers stay in their EDA cockpit, RTL teams stay in Git or Perforce, ops stays in PLM/ERP — Glide listens to the systems of record they already use and assembles the connected picture underneath them.
- No second system to update — signals are captured from tools of record
- No new workflow imposed on design, verification or operations
- Milestones, dependencies, IP usage and BoM changes flow in automatically
- The connected view is assembled for your teams, not by them
Glide Sits Above Your Stack — it assumes your Git, Perforce and EDA hygiene already exist, and adds the connective layer on top rather than replacing anything.
Your engineers keep working here
Git / Perforce
EDA cockpit
Jira / Jama
PLM / ERP
Glide Semi captures the signal automaticallymilestones · dependencies · IP usage · BoM changes — no new data entry
No new workflownothing extra to maintain
One source of truthassembled for you, not by you
Design → SiliconOne Continuous Flow From
One Continuous Flow From
Design Intent To Shippable Chip
The wall between design and operations is where schedules slip and yield surprises hide. Glide Semi removes it: GDSII isn’t thrown over a fence — it’s a governed hand-off on the same platform that carries the wafer through packaging, assembly, test and qualification.
Design Domain
1
Requirements
RTL/Design
2
3
Verification
IP Mgmt
4
GDSIItapeout hand-off design → operations
OPERATIONS DOMAIN — wafer → chip
process qual
5
Foundry / Wafer
Wafer Sort
6
package qual
7
Assembly & Package
Final Test
Test qual8
9
Qualification Ship
One Integrated Platform — no silos between design and operations
Project Mgmt
Requirements
Design/EDA
IP Management
MES
ERP
SourcingNo More Throw-Over-The-Wall. Project management, requirements, design/EDA, IP management, MES and ERP operate as one integrated platform — so a change in design is visible to operations, and a constraint from the fab or OSAT is visible to design, in the same place.
GDSIItapeout DB
Mask / Foundrywafer fab
Wafer Sortprobe · bin
Assemblydie attach · bond
Packagingsubstrate · mold
Final TestATE · burn-in
Qualified ChipJEDEC / AEC-QSourcing network
- ›Foundry
- ›Substrate
- ›OSAT (assembly)
- ›Test house
- ›Materials
Operations BoM · GDSII → Chip
Taking A Design From GDSII To A Wafer, And A Wafer To A Chip
When design signs off GDSII, the work isn’t done — it’s handed to operations. Glide carries that hand-off natively: the tapeout database feeds mask and foundry, the wafer moves through sort, assembly, packaging and final test, and the operations BoM (die, substrate, materials, package) is managed on the same platform as the IP that produced it.
- GDSII / tapeout database governed as the design-to-ops hand-off artifact
- Operations BoM — die, substrate, bond, package, materials — beside the IP BoM
- Inherent Qualifications Tracked: Process, Package, Assembly And Test Qual
- Bonding diagrams, package drawings, material specs and test specs anchored to the SKU
- Sourcing network managed — foundry, OSAT, substrate, test house and materials
Integrated, not bolted-on
Project, Requirements, Design, IP, MES And ERP — Integrated As One
Glide Semi is the connective tissue across the systems that run a semiconductor business. It integrates project management, requirements management, design/EDA tools, IP management, MES and ERP so that a single thread of truth runs from a requirement, through the IP that satisfies it, to the wafer and unit that ship against it.
- Requirements trace to the IP and silicon that fulfil them
- Design/EDA milestones and MES lot events on one timeline
- ERP sees IP licensing and BoM cost; operations sees design intent
- Provider-agnostic connectors — sits above the tools, replaces none
The Problem
Modern Silicon Isn’t A BOM Problem. It’s A Connected Graph — Across Design And Operations.
Every IP block, wrapper, license, GDSII drop, wafer lot, package and SKU is interconnected. When one thing changes, the impact propagates across programs and across the design-operations boundary. Reconstructing that by hand doesn’t scale.
Invisible blast radius
Teams cannot see every program, wrapper, vendor drop and downstream operation affected by one change.
Design-ops wall
GDSII gets thrown over a fence; packaging, assembly and test constraints surface too late to act on.
Licensing exposure
Per-use, per-program and royalty terms live in contracts — not where engineers design-in.
Sourcing blind spots
Foundry, OSAT, substrate and test dependencies are not linked to the design that relies on them.
Reconstructed, not reported
Impact analysis becomes a manual spreadsheet exercise that relies on memory and does not scale with reuse.
The Platform
Everything It Manages IP Through Operations
Glide Semi sits above your existing tools and models what they can’t: the relationships between IP, programs, licenses, vendors, sourcing and silicon.
Internal IPExternal IPLicensingMake-vs-BuyVendorsSCMIP RequestsDefectsOperations BoM
Internal IP Management
A unified catalog for every MAKE and REUSE block — versions, ownership, lifecycle state and technical milestones from spec-freeze to tapeout-ready.
External IP Management
Model licensed vendor blocks and the internal wrapper that consumes them — external and internal IP kept cleanly, explicitly distinct.
License Management
Per-use, per-program, royalty, subscription and perpetual models — with entitlements, scope, pricing and a live programs remaining position.
Make-Vs-Buy Analysis
Structured decisions for every block — cost, schedule, risk and reuse — that become a tracked BoM line, not a lost slide.
Vendor Collaboration
Bring IP vendors into the loop — deliveries, spec conformance, errata and version drops flow to the wrapper and fan out to every consumer.
SCM Integration
Provider-agnostic: Git, GitLab, Perforce, Gerrit. Milestones and results push in; dependency gates and CI triggers push back out.
IP Requests
One transaction pattern for every request — new IP, change, waiver, retirement — with request → promise → work → accept and full audit.
Defect & Errata Governance
A defect is the master record; vendor errata and internal finds are sources; wrapper mitigation and vendor fixes are independent resolutions.
Operations BoM & Traceability
Operations BoM, bonding diagrams, material specs, package drawings and datasheets — each anchored to the IP, program or product it governs.
Internal & External IP · Licensing
The Two-Layer Model That Keep Your IP Honest
Every internal IP is something you build (MAKE) or a wrapper around something you license (BUY). Glide models both layers explicitly — and meters real usage against the license so over-use and expiry surface before they become exposure.
Make · Buy · Reuse
Internal IP, External IP — One Catalog, Clear Boundary
Track what you own and what you license in a single portfolio, with the wrapper relationship first-class. When a vendor ships a new drop, Glide knows exactly which wrapper — and which programs — are affected.
- MAKE blocks, REUSE blocks and BUY wrappers in one lifecycle
- Vendor block and its wrapper kept distinct — never conflated
- Multi-vendor wrappers: one internal IP integrating several licensed blocks
Internal IP · wrapper (BUY)
Controller wrapperIn-house · v2.4RTL · integration · DRC
⊃External IP (licensed)3rd-party PCIe ControllerController IP Vendor · r6.10a
License LIC-1180
per-program · Active
per-program · Active
Program “Falcon”
consumes 1 of 3 slots
consumes 1 of 3 slots
License covers the block · wrapper consum
One model, many licensing bases
Per-program
Per-use
Royalty/unit
Subscription
Perpetual
Site/enterpriseLIC-1180 · entitlement position
Manufacture · per-program · max 3
Falcon
consumed
Titan
consumed
1 slot
remaining
A 4th program is blocked → escalate to amend the license
Licensing & RoyaltyLicensing
Licensing
— Engineers Can’t Accidentally Breach
Model any commercial arrangement — per-use, per-program, royalty, subscription, perpetual, site or enterprise — with entitlements, scope, pricing and obligations. Entitlement checks gate design-in, so a program that would exceed the license is stopped and escalated.
- Live “programs / units remaining” and expiry alerts
- Royalty Accrual On Shipment, With Vendor-Ready Usage Reports
- Territory, Field-Of-Use, Node, Foundry And Exclusivity Scope
Governance
Vendors, Defects And, Requests — Under Control
The operational backbone that turns a catalog into a managed portfolio.
Vendor involvement
Vendors are first-class actors. Delivery acceptance, spec conformance, re-synthesis, DRC confirmation and export clearance each drive the internal wrapper’s state — and every vendor milestone emits a paired internal-IP consequence, linked back to its trigger.
Defect & errata governance
One defect record is the master; vendor errata and internal finds are its sources; the vendor fix and the wrapper mitigation are two independent tracks that must both complete to close. “Fix released” is not “resolved.”
IP requests, one pattern
New IP, change, waiver, retirement — every request is the same transaction: request and promise, the type-specific work, then an explicit accept. One workspace, configured per type, fully auditable.
Design → Silicon
Full Lifecycle Traceability
From make-vs-buy through GDSII to a tested, qualified chip — every stage connected, every change traceable to the IP, license, program and sourcing it touches.
Plan & Decide
Make-vs-buy analysis; IP request raised; BoM line created.
License & Source
External IP licensed; vendor drop accepted into the wrapper.
Design & Verify
Spec -> RTL -> verification, from SCM.
Tapeout (GDSII)
DRC/LVS clean -> GDSII hand-off governed into operations.
Wafer -> package
Foundry, sort, assembly, packaging and final test with qualification.
Ship & Report
Royalty accrues on shipment; vendor usage reports generated.
Business Impact
Why Semiconductor Teams Choose Glide Semi
Built Bottom-Up For Silicon — From The IP Graph, Change Propagation And The Design-To-Operations Flow, Not BOM Governance Borrowed From Mechanical PLM.
Live
blast-radius on every change
1
platform for IP + operations
Zero
extra work for engineers
No
design-to-ops wall
Faster
time-to-market
Full
GDSII-to-chip traceability
Lower
cost of errors & rework
Instant
impact analysis, not reconstruction
Works With Your Stack
Sits Above Tool — Without Replacing Them
Git
GitLab
Perforce
Gerrit
Jira
Jama
EDA flows
MES
ERP
